I-PCB ene-Tg ephezulu

Iintlobo zeNdibano zePCBA

Indibano Yesivumelwano Se-elektroniki

Ukwenziwa kwePCB

Uzinzo oluphezulu lobushushu kwi-Advanced Electronics

Yintoni i-High-Tg PCB?

I-High-Tg PCB yibhodi yesekethe eprintiweyo eneqondo lobushushu lotshintsho lweglasi (Tg) eliyi-170°C nangaphezulu, eyahlula kwii-PCB eziqhelekileyo ze-FR-4 (Tg 130–140°C) kunye nee-PCB eziphakathi ze-Tg (150–160°C). I-Tg imele ubushushu apho i-substrate iguquka khona ukusuka kwimeko eqinileyo "enjengeglasi" ukuya kwimeko ethambileyo, efana nerabha. Ii-PCB eziphezulu ze-Tg zigcina amandla oomatshini, uzinzo olulinganayo, kunye nokusebenza kombane kumaqondo obushushu aphezulu, nto leyo eyenza ukuba zibe yimfuneko kwizicelo ezineemfuno ezingqongqo zobushushu.

Iinkcukacha zobuGcisa eziPhambili

-Ukumelana nobushushu: Isebenza ngokuthembekileyo ukuya kuthi ga kwi-130–150°C (20–25°C ngaphantsi kwe-Tg), ifanelekile kwi-solder engenalo i-lead (amaqondo obushushu aphinda abuyele kwi-260°C).
-Ukwakhiwa kwezinto: Isebenzisa ii-resin ze-epoxy eziguquliweyo okanye ii-composites ezizaliswe yi-ceramic ukuphucula ukumelana nobushushu.
Amanqanaba e-Tg:
+ Umgangatho we-FR-4: Tg 130-140 ° C
+I-Tg Ephakathi: 150–160°C
+I-High-Tg: ≥170°C (umz., 170°C, 180°C, 200°C)

Nantsi inkcazelo ngeenkonzo zethu eziphambiliIingenelo eziphambili ze-High-Tg PCBs

Iinkonzo ezipheleleyo phantsi kophahla olunye

Uzinzo oluPhezulu lobushushu

Ukuguqulwa okuncitshisiweyo: Igcina ukuqina kwiindawo ezinobushushu obuphezulu (umz., iimoto ezingaphantsi kwebhonethi, ii-oveni zemizi-mveliso).
Ukuthobela imithetho ngaphandle kwelothe: Iyamelana nokutshiza kwakhona kwe-solder kwi-240–260°C, nto leyo ebalulekileyo kwimveliso ehambelana ne-RoHS.

Utshintsho olukhawulezayo noluthembekileyo

Ukusebenza Okuphuculweyo KweeMechanical kunye Nombane

Ukuchaneka koBume: I-coefficient ephantsi yokwandiswa kobushushu (i-CTE) inciphisa ukugoba kwiindlela zoyilo lwe-multilayer.
Ukuthembeka kwe-PTH: Ukuba namandla ngokuncamathela kwiplati kunciphisa iingozi zokuqhekeka kwimijikelo yobushushu.

Ukumelana neekhemikhali kunye nokufuma

Uzinzo oluphezulu lokufuma: Ukufunxwa kwamanzi okuphantsi (≤0.15%) xa kuthelekiswa ne-FR-4 eqhelekileyo, okuthintela ukuqhekeka kwamanzi kwiimeko ezifumileyo.
Ukumelana neekhemikhali: Iyamelana nokuwohloka ngenxa yokukhupha ulwelo, izinto zokucoca, kunye neekhemikhali zoshishino.

Ukuguquguquka koyilo lweesekethe ezixineneyo

Ukuhambelana kwe-Multilayer kunye ne-HDI: Ixhasa ulwakhiwo oluncinci, olunamandla aphezulu ngaphandle kweendawo ezishushu.
Inkxaso yezinto ezidityanisiweyo: Idityaniswe nee-aluminium okanye ii-ceramic cores ukuze kulawulwe ubushushu obuphezulu.

Ukhetha nini ii-PCB eziphezulu ze-Tg?

Izicelo ezibalulekileyo

Ishishini	Sebenzisa ityala	Ingcebiso ye-Tg
Iimoto	Iiyunithi zokulawula iinjini (ii-ECU), izinzwa ze-ADAS	180°C+
Imizi-mveliso	Ii-inverters zamandla, ii-motor drives, izixhobo zokuwelda	170°C+
Inqwelo-moya	Ii-Avionics, imithwalo yesathelayithi	200°C+
Izixhobo ze-elektroniki zabathengi	Iiconsoles zemidlalo ezinamandla aphezulu, iibhodi zeseva	170°C+
Isibane se-LED	Ii-LED eziphumayo kakhulu, izibane zemoto	170°C+

Iikhrayitheriya zeSigqibo

Ubushushu bokusebenza >100°C
Funa i-solder engenalo i-lead (ukuthobela i-RoHS)
Uyilo lwe-multilayer olunokunyamezelana okuqinileyo kobushushu
Ukuvezwa kumswakama, iikhemikhali, okanye ukungcangcazela

Amandla okuvelisa kunye neenkcukacha

Uphawu	Ubuchule obuqhelekileyo	Iinketho Eziphambili
Amanqanaba e-Tg	170°C, 180°C, 200°C	Ii-composites ze-Tg eziphezulu ezenziwe ngokwezifiso (220°C+)
Ubalo lweeLeya	Iileya ezili-1–20	I-HDI ene-vias ezingaboniyo/ezingcwatywe
Iinketho zezinto eziphathekayo	I-FR-4 (i-epoxy ephezulu ye-Tg), i-ceramic, i-aluminium	Iilaminate zeRogers ezine-Tg ephezulu (umz., RO4835)
Ubukhulu beCopper	1/3 oz–5 oz	Ubhedu olunzima (6–10 oz kwiileya zamandla)
Ulawulo lobushushu	Ii-vias ezishushu, ukufakelwa kobhedu	Izinki zobushushu ezifakiweyo, izinto zokutshintsha isigaba
Ukugqitywa komphezulu	I-ENIG, i-HASL (engenalo ilothe), i-OSP	I-Gold plating (igolide eqinileyo yokunxibelelana okuthembekileyo kakhulu)
Uvavanyo	I-AOI, i-flying probe, uvavanyo lomothuko lobushushu	Ukuqinisekiswa kwe-Tg nge-DSC (Differential Scanning Calorimetry)

Iimbalasane zeNkqubo

I-Precision Lamination

Uxinzelelo olulawulwayo kunye nobushushu ukuthintela izithuba kwi-laminates ezine-Tg ephezulu.

Ukubhola ngeLaser

Kwi-microvias kwiibhodi ze-HDI (ukuya kuthi ga kwi-0.1mm).

Imaski yeSolder

Ii-inki ezimelana nobushushu obuphezulu (ziyanyamezela kwi-180°C+).

Kutheni Ukhetha Iinkonzo Zethu ze-High-Tg PCB?

Iminyaka engama-20 yoBugcisa boLawulo loBushushu

- Ubuchule bezinto eziphathekayo: Irekhodi eliqinisekisiweyo nge-FR-4 high-Tg (170°C–200°C) kunye nee-composites eziphambili.
- Umzobo okhawulezayo: Ukutshintsha kweentsuku ezi-3-5 kwii-PCB ezisemgangathweni ezine-Tg ephezulu, iintsuku ezi-7-10 kwiindlela ezintsonkothileyo zoyilo lwee-multilayer.
- Ukuqinisekisa umgangatho: Uhlolo lwe-optical oluzenzekelayo lwe-100% (AOI) kunye nohlalutyo lwe-X-ray ukuze kujongwe ukuthembeka.
- Ukuphucula iindleko: Uyilo lwe-hybrid (umongo ophezulu we-Tg + iileya eziqhelekileyo ze-FR-4) ukulinganisela ukusebenza kunye nohlahlo-lwabiwo mali.

Ithenjwa ziinkokeli zoshishino

IiPCB zethu ezine-Tg ephezulu zisetyenziswa kwezi:
- Iimoto: I-ECUs yee-OEM ezinkulu, eziqinisekisiweyo kwi-IATF 16949 kunye ne-AEC-Q200.
- Imizi-mveliso: Izixhobo zamandla kwiiprojekthi zamandla avuselelekayo, kunye neziqinisekiso zokuthembeka zeminyaka eli-10.
- Inqwelo-moya: Iimodyuli zolawulo lwendiza zihambelana ne-MIL-PRF-55110.

Fumana iKoteshini yasimahla yeProjekthi yakho ye-High-Tg PCB

Ngaba ukulungele ukwenza uyilo lwakho lwe-PCB lube ngokoqobo? Ukufumana ikowuteshini yasimahla yeprojekthi yakho ye-High-Tg PCB eyenziwe ngokwezifiso kukufutshane nje.
Cofa nje iqhosha elingezantsi ukuze ulayishe iifayile zakho zoyilo kunye neBill of Materials (BOM).
Iqela lethu liza kukunika isicatshulwa esineenkcukacha kwiiyure ezingama-48.

Fumana iKoteshini yasimahla ngoku Qhagamshelana nathi