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16-PCBA-Umgangatho

Ukuhlolwa noVavanyo

Ukuhlolwa noVavanyo e-STHL

Njengomvelisi we-ISO9001 oqinisekisiweyo wokuhlanganisa izixhobo ze-elektroniki, i-STHL Technology inamathela kulawulo olupheleleyo lomgangatho kunye nenkqubo. Uvavanyo kunye nokuhlolwa kuquka ukuhlolwa ngokwasemzimbeni nangokwembonakalo, uvavanyo oluvulekileyo nolufutshane, uvavanyo lwe-AOI, uvavanyo lwe-X-ray, kunye novavanyo lwe-In-Circuit. Sikwavavanya ukuguga kwibhodi kamama kunye nemveliso egqityiweyo. Le nkqubo yokuhlolwa kwe-PCBA iqinisekisa ukuba imveliso yokugqibela yabathengi iyahlangabezana neemfuno zabo zoyilo, kwaye ikwalawula yonke imveliso ukuya kumlinganiselo ophezulu ongenasiphako onciphisa lonke ixesha lokunikezelwa kwemveliso.

Uhlolo lwe-AOI 100_
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Uhlolo lwe-AOI 100%

Ukuhlolwa kwe-AOI kuye kwiPhakheji ye-0201
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Ukuhlolwa kwe-AOI kuye kwiPhakheji ye-0201

Uhlolo lwe-X-Ray
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Uhlolo lwe-X-Ray

Uvavanyo lwePrototype ye-PCBA SMT
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Uvavanyo lwePrototype ye-PCBA SMT

Imiyalelo ye-IQC
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Imiyalelo ye-IQC

Ukuhlolwa kwe-X-Ray ye-BGA
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Ukuhlolwa kwe-X-Ray ye-BGA

Uvavanyo lokwaluphala lweeyure ezi-8-12
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Uvavanyo lokwaluphala lweeyure ezi-8-12

Uvavanyo Oluyilwe Ngokweprojekthi
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Uvavanyo Oluyilwe Ngokweprojekthi

Uvavanyo lokwaluphala lweeyure ezili-12-24
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Uvavanyo lokwaluphala lweeyure ezili-12-24

Iinkonzo zoVavanyo eziBanzi

I-STHL inikezela ngezisombululo zovavanyo ezinokwenziwa ngokwezifiso ukuze zihlangabezane neemfuno zabathengi ezithile kunye neemfuno zemveliso.
Nantsi uluhlu oluqhelekileyo lweenkonzo zovavanyo ezibonelelwayo:
Uvavanyo lweSolder Paste yokuPrinta

Uvavanyo lweSolder Paste yokuPrinta

I-AOI

Uhlolo lwe-Optical oluZenzekelayo (AOI)

Uvavanyo lwe-ICT ngaphakathi kwesekethe

Uvavanyo lwe-ICT ngaphakathi kwesekethe

Ukuhlolwa kwe-X-Ray kwezinto ze-BGA (Ball Grid Array)

Ukuhlolwa kwe-X-Ray kwezinto ze-BGA (Ball Grid Array)

Uvavanyo Lokusebenza

Uvavanyo Lokusebenza

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uvavanyo

Uhlolo lweSolder Paste (SPI)

Ukuqinisekisa umgangatho ophezulu, sidibanisa iSolder Paste Inspection (SPI) kuyo yonke imveliso. Le nkqubo isebenzisa i-3D scanning ukuqinisekisa ivolumu yesolder paste kunye nokulungelelaniswa kwayo, ukuthintela iziphene zokunyibilikisa kwimvelaphi.

I-AOI

Uvavanyo lwe-AOI oluyi-100%

I-PCB nganye ihlolwa ngokuzenzekelayo ukuze kufunyanwe izinto ezingekhoyo, umonakalo, ukuphambuka, ukuhlanganiswa okungafanelekanga, nokunye.

Uvavanyo oluqhutywa kwiSekethe

Uvavanyo lwe-ICT ngaphakathi kwesekethe

Esi sixhobo sokuvavanya esizenzekelayo sivavanya ngokupheleleyo iibhodi zesekethe, kuquka amaxabiso ezinto, uqhagamshelo lwesekethe, kunye noyilo lwebhodi. Sichonga izinto ezingaqhelekanga kwaye sikhuthaze amanyathelo okulungisa, siqinisekisa umgangatho ohambelanayo kwaye sinciphise iziphene.

Ukuhlolwa kwe-X-Ray kwezinto ze-BGA (Ball Grid Array)

Uhlolo lwe-X-Ray

Le teknoloji inesisombululo esiphezulu ibonelela ngovavanyo olunzulu lweendibano ze-BGA, iqinisekisa ukubekwa ngokufanelekileyo kwezixhobo kunye nokuchonga iziphene ezinokubakho ezifana nokuhlanganiswa okungekho mthethweni, iibhola ze-solder ezingekhoyo, kunye nemiba ye-encapsulation. Ikwanceda ekufumaneni ukungalungelelani, iibhulorho ze-solder, kunye nezinye iziphene zokwenza.

Uvavanyo Lokusebenza

Uvavanyo lweMisebenzi

I-PCB nganye ivavanywa ngokusebenza ngokupheleleyo, okufana novavanyo oluqhutywa ngaphakathi kwisekethe, ukuqinisekisa ukusebenza kakuhle.