Uvavanyo lweSolder Paste yokuPrinta









Ukuqinisekisa umgangatho ophezulu, sidibanisa iSolder Paste Inspection (SPI) kuyo yonke imveliso. Le nkqubo isebenzisa i-3D scanning ukuqinisekisa ivolumu yesolder paste kunye nokulungelelaniswa kwayo, ukuthintela iziphene zokunyibilikisa kwimvelaphi.
I-PCB nganye ihlolwa ngokuzenzekelayo ukuze kufunyanwe izinto ezingekhoyo, umonakalo, ukuphambuka, ukuhlanganiswa okungafanelekanga, nokunye.
Esi sixhobo sokuvavanya esizenzekelayo sivavanya ngokupheleleyo iibhodi zesekethe, kuquka amaxabiso ezinto, uqhagamshelo lwesekethe, kunye noyilo lwebhodi. Sichonga izinto ezingaqhelekanga kwaye sikhuthaze amanyathelo okulungisa, siqinisekisa umgangatho ohambelanayo kwaye sinciphise iziphene.
Le teknoloji inesisombululo esiphezulu ibonelela ngovavanyo olunzulu lweendibano ze-BGA, iqinisekisa ukubekwa ngokufanelekileyo kwezixhobo kunye nokuchonga iziphene ezinokubakho ezifana nokuhlanganiswa okungekho mthethweni, iibhola ze-solder ezingekhoyo, kunye nemiba ye-encapsulation. Ikwanceda ekufumaneni ukungalungelelani, iibhulorho ze-solder, kunye nezinye iziphene zokwenza.
I-PCB nganye ivavanywa ngokusebenza ngokupheleleyo, okufana novavanyo oluqhutywa ngaphakathi kwisekethe, ukuqinisekisa ukusebenza kakuhle.