Uvavanyo Lokuqala Olubalulekileyo: Indlela i-STHLPCBA 3D SPI Eqinisekisa Ngayo Ukugqibelela Kwe-Solder Paste
Amandla e-2D vs. 3D SPI
I-2D SPI yesiqhelo ilinganisa indawo yokuncamathisela kuphela, ingenayo ivolumu ebalulekileyo kunye nolwazi lokuphakama. Idiphozithi yokuncamathisela enendawo echanekileyo kodwa ukuphakama okunganelanga kuya kubangela isiphene. Iinkqubo zethu ze-3D SPI zisebenzisa iindlela eziphambili zokukhanya—i-phase shift profilometry okanye i-laser triangulation—ukulinganisa ivolumu, ukuphakama, indawo, kunye nokulungelelaniswa ngaxeshanye. Lo mfanekiso upheleleyo uchonga iziphene ezinokuthi ziphoswe luhlolo lwe-2D, kubandakanya ukuphakama okunganelanga kokuncamathisela, ivolumu yokuncamathisela egqithisileyo, kunye nokungahambi kakuhle okuncinci.
Iiparamitha zoMlinganiselo we-SPI eziphambili
I-3D SPI yethu ibamba imilinganiselo emine ebalulekileyo yediphozithi nganye yepeyinti: ivolumu (isixa sisonke sepeyinti, esamkelekileyo ngaphakathi kwe-±30% yomthamo wokuvula istencil), ukuphakama (ubukhulu bomaleko wepeyinti, esamkelekileyo ngaphakathi kwe-±25% yobukhulu bestencil), indawo (ububanzi beenyawo, kufuneka bube ubuncinane yi-50% yendawo yepeyinti kodwa bungadluli kwimida yepeyinti), kunye nokulungelelaniswa (ukusuka kwiziko lepeyinti, esamkelekileyo ngaphakathi kwe-±25% yobubanzi bepeyinti). Ipharamitha nganye inemida enokulungiselelwa ngokusekelwe kuhlobo lwenxalenye kunye nepitch.
Ulawulo lweNkqubo oluQhutywa yiDatha ye-SPI
Iinkqubo zethu ze-SPI zenza okungaphezulu nje kokukhetha okulungileyo kokubi—zibonelela ngolwazi lwenkqubo ngexesha langempela. Iitshathi zolawulo lwenkqubo yezibalo zilandelela ivolumu kunye neendlela zokuphakama kuyo yonke ibhodi nakwimisebenzi yemveliso. Xa iindlela zisondela kwimida yolawulo, impendulo evaliweyo ithumela ngokuzenzekelayo iiparameter zokulungisa kwiprinta—ilungisa uxinzelelo lwe-squeegee, isantya sokwahlulwa, okanye ulungelelwaniso. Olu phuculo lwexesha langempela lugcina ushicilelo ngaphakathi kweenkcukacha ngaphandle kokungenelela komqhubi.
Iindlela zokusilela ze-SPI kunye neempendulo
Ukusilela kwe-SPI okwahlukeneyo kubonisa iingxaki ezahlukeneyo ezifuna iimpendulo ezahlukeneyo. Ubuninzi obungonelanga budla ngokubonisa ukuvaleka kwe-stencil okufuna ukucocwa, i-squeegee egugileyo efuna ukutshintshwa, okanye i-paste enganeleyo edinga ukongeza. Ubuninzi obugqithisileyo budla ngokubonisa isantya sokwahlulwa kwe-stencil esingalunganga okanye uxinzelelo olugqithisileyo lwe-squeegee. Ukungalingani kakuhle kubonisa iimpazamo zokubeka iipaneli ezifuna uhlengahlengiso lwe-fiducial. Iinkqubo zethu ze-SPI zihlela ukusilela ngohlobo, zikhokela abaqhubi kwisenzo sokulungisa esifanelekileyo.
Ukugcinwa kweDatha ye-SPI kunye nokulandelelwa kwayo
Yonke imilinganiselo ye-SPI igcinwa kwinkqubo yethu ye-MES, iqhagamshelwe kwinombolo ye-serial yebhodi nganye kunye ne-stencil esetyenzisiweyo. Le datha ibonelela ngembali epheleleyo yokuprinta i-paste kwibhodi nganye, ixhasa uhlalutyo lwesizathu seengxaki ezisezantsi, ivumela uhlalutyo lwamandla enkqubo ukuze kuphuculwe rhoqo, kwaye iyahlangabezana neemfuno zabathengi zoxwebhu lwenkqubo.
Ukuprinta i-solder paste sisiseko somgangatho we-SMT. Amandla ethu e-3D SPI aqinisekisa ukuba ibhodi nganye iqala ngeediphozithi ze-paste ezigqibeleleyo, ezithintela iziphene ngaphambi kokuba zenzeke endaweni yokuzibona emva kokuhlanganiswa.
Musa ukuvumela iziphene ezifihlakeleyo zepeyinti ziphazamise ukuhlanganiswa kwakho. Nxibelelana nathi ukuze ufunde indlela inkqubo yethu ye-3D SPI ekhusela ngayo iimveliso zakho kwinyathelo lokuqala Indibano ye-SMT.